Test probe and tester, method for manufacturing the test probe

ABSTRACT

A test probe having a conductive part electrically connected to terminals of a test-object device, including: a silicon substrate; a protrusion made of resin provided on the silicon substrate; a first conductive part which is provided on the protrusion and comes in contact with the terminals; and a second conductive part which is provided in a region other than a region having the protrusion on the silicon substrate and is electrically connected to the first conductive part.

CROSS REFERENCE TO RELATED APPLICATIONS

This application is a divisional patent application of U.S. Ser. No.11/184,763 filed Jul. 19, 2005, claiming priority to Japanese PatentApplication No. 2004-262273 filed Sep. 9, 2004, all of which areincorporated by reference.

BACKGROUND OF THE INVENTION

1. Technical Field

The present invention relates to a test probe and a tester and a methodfor manufacturing the test probe.

2. Related Art

In a general procedure of manufacturing a liquid-crystal panel display,there is a process in which short circuit, wire breakage, displaycharacteristics, and the like are tested. In such a test process, atester having a test probe is used. The test probe includes a conductivepart having a plurality of connection terminals connected to scanningline terminals or data line terminals of the liquid-crystal paneldisplay which is the device to be tested (the object device). A distancebetween the connection terminals (hereinafter referred to as a “pitch ofthe probe-side terminals” when appropriate) corresponds to a distancebetween the scanning line terminals or between the data line terminals(hereinafter referred to as a “pitch of the object-side terminals” whenappropriate) of the liquid-crystal display panel. The patent publicationreferenced below discloses an example of a technique pertaining to atester having a test probe. The test probe disclosed in this patentpublication includes a conductive part having the connection terminalson a flexible substrate made of polyimide or the like.

Japanese Unexamined Patent Publication No. 2000-56285 is the example ofrelated art.

However, there is a problem in the described conventional technology.Along with the liquid-crystal panel display that is becoming more highlyprecise in recent years, the pitch of the object-side terminals isbecoming smaller (narrower). Accordingly, the pitch of the probe-sideterminals of the test probe is also required to be smaller (narrower).However, with a composition of the conventional technology containingthe conductive part having the connection terminals on the flexiblesubstrate, it is difficult to narrow the pitch of the probe-sideterminals.

SUMMARY

An advantage of the invention is to provide a test probe that can copewith narrowing of the pitch of the probe-side terminals and can test theobject device well, a tester having the test probe, and a method formanufacturing the test probe.

According to an aspect of the invention, a test probe having aconductive part electrically connected to terminals of a test-objectdevice includes: a silicon substrate; a protrusion made of resinprovided on the silicon substrate; a first conductive part which isprovided on the protrusion and comes in contact with the terminals; anda second conductive part which is provided in a region other than aregion having the protrusion on the silicon substrate and iselectrically connected to the first conductive part.

In this case, because the conductive part is formed on the siliconsubstrate, it is possible to obtain a minute conductive part.Accordingly, the test probe can cope with the narrowing of the pitch ofthe object-side terminals. Further, because the first conductive partthat directly contacts the terminals of the object device is provided onthe protrusion made of resin, the first conductive part can well contactthe terminals of the object device when brought into contact due to theelasticity of the resin protrusion that is a base of the firstconductive part.

With the test probe of the invention, the first conductive part mayinclude a plurality of first wiring patterns arranged in a firstdirection corresponding to the terminals, and the second conductive partmay include a plurality of second wiring patterns corresponding to thefirst wiring patterns.

In this case, because the first conductive part may include theplurality of first wiring patterns arranged in the first direction so asto correspond with the plurality of terminals of the object devicearranged in the first direction, the test probe can well test the objectdevice by bringing the first wiring patterns into contact with theterminals. Also, because the second conductive part may include thesecond wiring patterns formed on the silicon substrate corresponding tothe first wiring patterns, the test probe can have the second wiringpatterns that are minute.

With the test probe of the invention, the protrusion may extend in thefirst direction so as to hold each of the plurality of first wiringpatterns.

In this case, because the protrusion may be formed so as to extend inthe first direction along the arrangement direction of the first wiringpatterns, the plurality of first wiring patterns can be provided on thesame protrusion. Therefore, variation in the arrangement of the firstwiring patterns in the height direction can be minimized.

With the test probe of the invention, a region on the protrusion surfaceother than a region having the first wiring patterns may be dented.

In this case, because the region on the surface of the protrusion otherthan the region having the first wiring patterns, or, more specifically,the region between the first wiring patterns, may be dented, theprotrusion as the base of the first wiring patterns may deform whencoming in contact with the terminals of the object device. Accordingly,due to the deformation, the first wiring patterns can well contact theterminals of the object device.

With the test probe of the invention, the protrusion surface may beformed in a shape of an arch when seen cross-sectionally, bulging in adirection opposite from the silicon substrate.

In this case, because the first conductive part may be formed on thesurface of the protrusion having a shape of an arch when seencross-sectionally, the conductive part can well contact the terminals.Further, because the protrusion surface may be arched when seencross-sectionally, the first conductive part can well adhere to theprotrusion surface when setting the first conductive part on theprotrusion surface.

With the test probe of the invention, a first insulating layer may beprovided between the silicon substrate and the second conductive part.

In this case, because the silicon substrate may be electricallyinsulated from the second conductive part by the first insulating layer,the object device can be well tested.

With the test probe of the invention, the first insulating layer mayinclude organic matter.

In this case, by composing the first insulating layer with organicmatter, namely, an organic resin, the second conductive part provided onthe layer thereon can well contact outer devices.

With the test probe of the invention, a second insulating layer may beprovided so as to cover the first insulating layer.

In this case, the second conductive part can be protected by the secondinsulating layer.

With the test probe of the invention, a third insulating layer made ofresin may be provided on a second surface of the silicon substrateopposite from a first surface having the protrusion and the conductivepart.

In this case, the third insulating layer made of resin can protect thesecond surface of the silicon substrate and prevent breakage of thesilicon substrate.

With the test probe of the invention, the third insulating layer mayinclude a sheet form.

In this case, the third insulating layer may be provided on the secondsurface of the silicon substrate by simply adhering the sheet form tothe second surface of the silicon substrate.

With the test probe of the invention, an electronic unit that suppliesan electric signal to the terminals may be mounted on the siliconsubstrate.

In this case, a highly precise display test is possible when the objectdevice is, for example, a display device.

According to another aspect of the invention, a tester of the inventionmay include the above-described test probe.

In this case, the object device can be well tested by use of the testprobe that can cope with the narrowing of the pitch of the objectdevice.

With the tester of the invention, a part of the second conductive partmay be electrically connected to a second substrate mounted with theelectronic unit that supplies an electric signal to the terminals.

In this case, the electronic unit is mounted on the second substratethat is different from the test probe directly connected to the objectdevice, and, by connecting the second substrate with the part of thesecond conductive part of the test probe, a highly precise display testis possible if the test-object is the display device. Further, even whenthe test probe directly connected to the object device deteriorates,only the test probe needs be replaced instead of replacing theelectronic unit with a new one.

With the tester of the invention, the second substrate may include asilicon substrate.

In this case, by also forming the second substrate with silicon, theconductive part corresponding to the conductive part of the test probethat is already minutely made can be formed on the second substrate.

With the tester of the invention, the second substrate may include aglass substrate.

In this case, because the second substrate may be a glass substrate, itis possible to grasp visually (or by use of an opticalposition-detection device) the connection of the conductive part of thesecond substrate connected to the second conductive part of the testprobe while positioning them through the second glass substrate duringthe connection. Therefore, the positioning during the connection can becarried out smoothly.

According to yet another aspect of the invention, a method formanufacturing a test probe includes: having a conductive partelectrically connected to terminals of a test-object device; providing aprotrusion made of resin on a silicon substrate; providing a firstconductive part that comes in contact with the terminals on theprotrusion; and providing a second conductive part that is electricallyconnected to the first conductive part in a region other than a regionhaving the protrusion on the silicon substrate.

In this case, because the conductive part may be formed on the siliconsubstrate, it is possible to obtain the minute conductive part.Accordingly, the test probe can cope with the narrowing of the pitch ofthe object-side terminals. The first conductive part that comes directlyin contact with the terminals of object device may be provided on theprotrusion made of resin, and, therefore, when the first conductive partcontacts the terminals of the test-object, the first conductive part canwell contact the terminals of the object device due to the elasticity ofthe resin protrusion being the base of the first conductive part.

The method of the invention may further include: forming the protrusionso as to extend in a first direction; and providing a plurality of firstwiring patterns in the first direction on the protrusion as the firstconductive part.

In this case, because the protrusion may be formed so as to extend inthe first direction along the direction in which the first wiringpatterns are arranged, the plurality of first wiring patterns can beprovided on the same protrusion. Therefore, variation in the arrangementof the first wiring patterns in the height direction can be minimized.

The method of the invention may further include denting a region on theprotrusion surface other than a region having the first wiring patternsby half-etching.

In this case, because the region on the surface of the protrusion otherthan the region having the first wiring patterns, or, more specifically,the region between the first wiring patterns, may be dented, theprotrusion as the base of the first wiring patterns may deform whencoming in contact with the terminals of the object device. Accordingly,due to the deformation, the first wiring patterns can well contact theterminals of the object device.

The method of the invention may further include forming the protrusionin a shape of an arch when seen cross-sectionally, the surface thereofbulging in a direction opposite from the silicon substrate.

In this case, because the first conductive part may be provided on thesurface of the protrusion in a shape of an arch when seencross-sectionally, the conductive part can well contact the terminals.Further, because the protrusion surface may be arched in across-sectional view, the first conductive part can well adhere to theprotrusion surface when setting the first conductive part on theprotrusion surface.

The method of the invention may further include forming the protrusionby dispensing a function liquid containing the protrusion-forming resinfrom a liquid dispensing head onto the silicon substrate.

In this case, the protrusion can be smoothly formed without wasefullyusing the material.

The method of the invention may further include forming a secondinsulating layer so as to cover the second conductive part.

In this case, the second conductive part may be protected by the secondinsulating layer.

The method of the invention may further include thinning the siliconsubstrate.

In this case, by thinning the silicon substrate and giving elasticitythereto, handling of the test probe my be easy; the test probe can wellcontact the object device; and, further, the second conductive part canwell contact other devices such as the second substrate.

The method of the invention may further include providing a thirdinsulating layer made of resin on a second surface of the siliconsubstrate opposite from a first surface having the protrusion and theconductive part.

In this case, the third insulating layer made of resin can protect thesecond surface of the silicon substrate and can prevent breakage of thethinned silicon substrate.

The method of the invention may further include adhering a sheet form tothe second surface of the silicon substrate as the third insulatinglayer.

In this case, the third insulating layer may be provided on the secondsurface of the silicon substrate by simply adhering the sheet form tothe second surface of the silicon substrate.

The method of the invention may further include thinning the siliconsubstrate by treating the second surface before providing the thirdinsulating layer.

In this case, the silicon substrate may obtain elasticity when thinned,and, furthermore, the breakage or the like of the thinned siliconsubstrate may be prevented.

The method of the invention may further include dicing the siliconsubstrate per every test probe after forming the plurality of testprobes on the same silicon substrate almost simultaneously.

In this case, by forming the plurality of test probes almostsimultaneously, followed by dicing of the silicon substrate per everytest probe, the test probe can be manufactured effectively and at lowcost.

The method of the invention may further include: adhering a sheet formto the second surface of the silicon substrate opposite from the firstsurface having the protrusion and the conductive part; and dicing thesilicon substrate together with the sheet form.

In this case, dicing can be smoothly conducted by adhering the sheetform to the silicon substrate before dicing. Then, by simply using thesheet form used for the dicing as the third resin layer, the number ofthe manufacturing steps can be reduced, and the test probes can bemanufactured at low cost.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers refer to like elements and wherein:

FIG. 1 is a perspective view of a first embodiment of the test probe.

FIG. 2 is a cross-sectional view of the test probe.

FIG. 3 is an enlarged cross-sectional view of the test probe.

FIG. 4 is a perspective view of a second embodiment.

FIG. 5 shows an example of a process for manufacturing the test probe.

FIG. 6 shows an example of a process for manufacturing the test probe.

FIG. 7 shows an example of a process for manufacturing the test probe.

FIG. 8 is a flat pattern view of a working example of a tester.

DESCRIPTION OF THE EMBODIMENTS

Embodiments of the invention will now be described. In the followingdescriptions, an XYZ rectangular coordinate system is established, and apositional relation of the elements will be described with reference tothis system. Further, a predetermined direction on a level surface is anX-axis direction; a direction perpendicular to the X-axis direction onthe level surface is a Y-axis direction; and a direction perpendicularto both X- and Y-axis directions (in other words, a vertical direction)is a Z-axis direction. Furthermore, rotational directions around the X-,Y-, and Z-axes are θX, θY, and θZ, respectively.

<Test Probe>

First Embodiment

The first embodiment of the test probe will be described with referenceto the accompanying drawings. FIG. 1 shows perspective views of a testprobe 1 of the present embodiment and a part of a liquid-crystal paneldisplay that is the device to be tested. FIG. 2 is a sectional side viewof the test probe 1 (1A), and FIG. 3 is a diagram of the test probe 1Aseen from a +X side.

In these drawings, the test probe 1 (1A, 1B) includes: a siliconsubstrate 2, a protrusion 3 made of resin and provided on the siliconsubstrate 2, and a conductive part 9 provided on the silicon substrate 2and electrically connected to scanning line terminals 206 or data lineterminals 306 of the liquid-crystal panel display 100 which is the testobject device. The conductive part 9 is composed of a first conductivepart 4 provided on the protrusion 3 on the silicon substrate 2 and asecond conductive part 5 provided in a region on the silicon substrate 2other than the region having the protrusion 3 and electrically connectedto the first conductive part 4. There is a first insulating layer 6between the silicon substrate 2 and the second conductive part 5, andthe second conductive part 5 is provided on an upper surface of thefirst insulating layer 6. Further, the protrusion 3 is also provided onthe upper surface of the first insulating layer 6. Also, on the siliconsubstrate 2, a third insulating layer 7 made of resin is provided on anupper surface 2A having thereon the first insulating layer 6, theprotrusion 3, and the first and second conductive parts 4 and 5 and on alower surface 2B opposite the upper surface 2A.

The test probe 1 is used for testing short circuit or wire breakage inthe liquid-crystal panel display 100, which is the device to be tested,or for testing the display characteristics and the like. As shown inFIG. 1, the liquid-crystal panel display 100 has two substrates 200 and300 made of glass or the like, which are put together so as to opposeone another. Further, liquid crystal is encapsulated into a gap betweenthe substrates 200 and 300. On the two substrates 200 and 300, aplurality of scanning lines 202 are formed along the X-axis direction inparallel to each other on a lower surface 200A of the substrate 200 (asurface opposite from the substrate 300), and a plurality of data lines302 are formed along the Y-axis direction in parallel to each other on aupper surface 300A of the substrate 300 (a surface opposite from thesubstrate 200). Furthermore, on the lower surface 200A of the substrate200, the plurality of scanning line terminals 206 that draw out thescanning lines 202 to the outside are arranged in the Y-axis directionin a predetermined region of a −X-side end portion 204. Likewise, on thelower surface 300A of the substrate 300, the plurality of data lineterminals 306 that draw out the data lines 302 to the outside arearranged in the X-axis direction in a predetermined region of a −Y-sideend portion 304.

Additionally, the liquid-crystal panel display 100 having such acomposition is generally applied to an active matrix liquid-crystalpanel in which pixel electrodes are driven by use of a two-terminal typenonlinear element such as a thin film diode (TFD), or to a passivematrix liquid-crystal panel in which a nonlinear element is not used.However, the invention can also be applied to other liquid-crystalpanels such as one having terminals that draw out the scanning lines anddata lines to the outside on one of the substrates, such as, forexample, an active matrix liquid-crystal panel using a three-terminaltype nonlinear element such as a thin film transistor (TFT) elementwhich is used as an element to switch the pixel electrodes.

The scanning line terminals 206 are tip portions of the plurality ofscanning lines 202 formed on the substrate 200. Now, with aliquid-crystal panel display 100 determined as normal by the tester ofthe embodiment, a bear chip for driving each of the scanning lines iscoupled to the scanning line terminals 206 and to outer terminals (notshown) which are provided so as to oppose the scanning line terminals206 at a position away from the scanning line terminals 206 in thepredetermined region 204. The bear chip is mounted on the substrate 200by a technique such as a chip-on-glass (COG) technique, and the outerterminals are coupled to flexible printed circuits (FPCs) that supplycontrol signals from the outside to the bear chip. Similarly, also on aportion of the data line terminals 306 on the substrate 300, the bearchip and the FPCs are coupled. However, since the present embodiment istargeted at the liquid-crystal panel display 100 before being tested,neither the bear chip nor the FPCs are mounted or coupled at this point.

In the following, the test probe 1 (1A) that conducts the test uponbeing coupled to the scanning line terminals 206 of the liquid-crystalpanel display 100 will be described. However, a description of the testprobe 1 (1B) that conducts the test upon being coupled to the data lineterminals 306 will be omitted, since the test probes 1A and 1B have anidentical composition.

The first conductive part 4 of the test probe 1(1A) is composed of aplurality of first wiring patterns 4L arranged in the Y-axis directioncorresponding to the scanning line terminals 206. The first wiringpatterns 4L are provided so as to be coupled to each of the scanningline terminals 206. A distance between the first wiring patterns 4L (thepitch of the probe-side terminals) corresponds to a distance between thescanning line terminals 206 (the pitch of the object-side terminals) ofthe liquid-crystal panel display 100. Further, the second conductivepart 5 is composed of a plurality of second wiring patterns 5L providedcorresponding to the first wiring patterns 4L. The second wiringpatterns 5L are each coupled to the first wiring patterns 4L, arrangedand extending in the X-axis direction, in the region other than theregion having the protrusion 3 on the silicon substrate 2 (the firstinsulating layer 6).

A material used to form the first conductive part 4 or the secondconductive part 5 is, for example, gold (Au), copper (Cu), silver (Ag),titanium (Ti), tungsten (W), titanium tungsten (TiW), nickel (Ni),nickel vanadium (NiV), chromium (Cr), or aluminum (Al).

Since the plurality of first wiring patterns 4L are arranged in theY-axis direction so as to correspond with the scanning line terminals206 of the liquid-crystal panel display 100, the test probe 1 can welltest the liquid-crystal panel display 100 by contacting the first wiringpatterns 4L with the scanning line terminals 206. Further, by using aflexible material such as silver (Ag) as the material for forming thefirst conductive part 4 (the first wiring patterns 4L), the first wiringpatterns 4L can adhere well to the scanning line terminals 206.

The protrusion 3 is provided at a +X-side end portion on the siliconsubstrate 2, extending in the Y-axis direction so as to be able tosupport each of the plurality of first wiring patterns 4L, that is, tobe able to hold each of the plurality of first wiring patterns 4L. Thesurface of the protrusion 3 is formed in a shape of an arch when seencross-sectionally, bulging in an opposite direction, that is, in anupper (+Z) direction, from the silicon substrate 2, and the protrusion 3as a whole is in a half-cylindrical shape. Further, as shown in FIG. 3,the region on the surface of the protrusion 3 other than the regionhaving the first wiring patterns 4L is dented, forming dented parts 3Dsbetween the first wiring patterns 4L.

As thus described, because the protrusion 3 is formed so as to extend inthe Y-axis direction along the direction in which the first wiringpatterns 4L are arranged, the plurality of first wiring patterns 4L canbe provided on the same protrusion 3. Therefore, variation in thearrangement of the first wiring patterns in the height direction can beminimized. Also, because the first wiring patterns 4L of the firstconductive part 4 are held on the surface of the half-cylindricallyshaped protrusion 3, they can well contact the scanning line terminals206. Further, because the surface of the protrusion 3 is arched whenseen cross-sectionally, the first wiring patterns 4L can be adhered wellto the surface of the protrusion 3 when forming the first wiringpatterns 4L thereon. Furthermore, because the regions between the firstwiring patterns 4L are the dented parts 3Ds on the surface of theprotrusion 3, the protrusion 3 which is the base of the first wiringpatterns 4L deforms when the first wiring patterns 4L come in contactwith the scanning line terminals 206. Accordingly, due to thedeformation, the first wiring patterns 4L can well contact the scanningline terminals 206. Here, it is desirable that the dented part 3D of theresin part 3 of has a depth of 5 μm or more. The protrusion 3 canthereby sufficiently deform.

As mentioned above, the protrusion 3 is composed of resin (syntheticresin). A material for forming the protrusion 3 is, for example,polyimide resin, silicone-modified polyimide resin, epoxy resin,silicone-modified epoxy resin, acrylic resin, phenol resin,benzocyclobutene (BCB), or polybenzoxazole (PBO).

The first insulating layer 6 is used to electrically insulate thesilicon substrate 2 from the second conductive part 5 and is provided onthe surface of the silicon substrate 2. The first insulating layer 6 maybe inorganic matter such as SiO₂ or organic matter (resin). In thiscase, if the first insulating layer 6 is composed of organic matter(organic resin), owing to its elasticity, the second conductive part 5provided on the upper layer of the first insulating layer 6 can wellcontact outer devices (a bear chip 10 and a second substrate 20 as willbe described later). Further, by using a flexible material such assilver (Ag) as the material for forming the second conductive part 5(the second wiring patterns 5L), the second conductive part 5 can havegood adhesiveness to the outer devices.

On the silicon substrate 2, the bear chip (the electronic unit) 10,which drives each of the scanning lines 202 by supplying electricsignals to the scanning line terminals, is mounted on the secondconductive part 5 (the second wiring patterns 5L) by use of ananisotropic adhesive or the like. Further, one end portion (+X-side endportion) of the second wiring patterns 5L is coupled to the first wiringpatterns 4L as the connection terminals as described, and the other endportion (−X-side end portion) functions as the connection terminalsconnected to the outer devices. The connection terminals 5T, which arethe other end portion of the second conductive part 5, are connected toa circuit substrate (not shown) that supplies the control signals to thebear chip 10. The bear chip 10 here is identical, for example, to onethat gets mounted on the predetermined region 204 of the substrate 200after the test. Accordingly, when testing the liquid-crystal paneldisplay 100, the high-precision display test adjusted to actual drivingconditions of the liquid-crystal panel display 100 is possible.

In the region other than the region for mounting the first conductivepart 4, the connection terminals 5T, and the bear chip 10, there isprovided a second insulating layer 8. The second insulating layer 8 isto cover the second conductive part 5 in the region other than theregion for mounting the outer terminals 5T and the bear chip 10, therebyprotecting the second conductive part 5. As a material for forming thesecond insulating layer 8, a synthetic resin such as polyimide resin maybe used.

The silicon substrate 2 is formed to have a thickness of 200 μm or less.Consequently, it is easy to conduct paralleling of the liquid-crystalpanel display 100 and the substrate 200. Further, because a thirdinsulating layer 7 made of resin is provided on the lower surface 2B ofthe silicon substrate 2, the lower surface 2B of the silicon substrate 2is protected by the third insulating layer 7, and breakage (crack) ofthe second silicon substrate 2 can be prevented.

As a material for forming the third insulating layer 7, a material wellknown in the art such as polyimide resin may be used. Further, it ispossible to form the third insulating layer 7 by coating the lowersurface 2B of the silicon substrate 2 with a solution (dispersingsolution) including the mentioned material by, for example, spin-coatingor, alternatively, by applying the sheet form including the mentionedmaterial on the lower surface 2B of the silicon substrate 2. By usingthe sheet form in order to form the third insulating layer 7, the thirdinsulating layer 7 can be provided on the lower surface 2B of thesilicon substrate 2 by simply applying the sheet form to the lowersurface 2B of the silicon substrate 2.

When testing the liquid-crystal panel display 100 using the test probe 1(1A, 1B) having the above-described composition, as shown in FIG. 1, thefirst conductive part 4 (the first wiring patterns 4L) of the test probe1A is brought into contact with the scanning line terminals 206 of theliquid-crystal panel display 100. Then, while keeping the scanning lineterminals 206 of the liquid-crystal panel display 100 and the firstwiring patterns 4L of the test probe 1A in position, the siliconsubstrate 2 of the test probe 1A is pressed against the substrate 200 ofthe liquid-crystal panel display 100 using a presser (not shown) made ofelastic matter. As a consequence, the scanning line terminals 206 areadhered and electrically connected to the first wiring patterns 4L.Similarly, while keeping the data line terminals 306 of theliquid-crystal panel display 100 and the first wiring patterns 4L of thetest probe 1B in position, the silicon substrate 2 of the test probe 1Bis pressed against the substrate 300 of the liquid-crystal panel display100 using a presser (not shown) made of elastic matter. As aconsequence, the data line terminals 306 are adhered and electricallyconnected to the first wiring patterns 4L.

Then, the control signals (electric signals) to the bear chip 10 aresupplied to the connection terminals 5T of each of the test probes 1Aand 1B. Consequently, a condition is set for the plurality of scanninglines 202 on the substrate 200 and the plurality of data lines 302 onthe substrate 300 to receive from the bear chip 10 the same drivingsignals as those when the bear chip 10 is mounted on the terminalportions of the substrates 200 and 300 by the COG technique.Accordingly, by examining the liquid display in this condition by use ofan image analysis such as a CCD or visually, the display test such asthe pixel defect test can be conducted.

Because the conductive part 9 is formed on the silicon substrate 2, thetest probe 1 having the composition as described above can have theminute conductive part 9. Accordingly, even if the liquid-crystal paneldisplay 100 becomes more highly precise, and, thereby, the pitch of thescanning line terminals or of the data line terminals narrows, the testprobe 1 can cope with the narrowing of the pitch. Further, because thefirst conductive part 4 that directly comes in contact with the scanningline terminals 206 or the data line terminals 306 of the liquid-crystalpanel display 100 is provided on the protrusion 3 made of resin, andbecause of the elasticity of the resin protrusion 3 being the base ofthe first conductive part 4, the first conductive part 4 can wellcontact the scanning line terminals 206 or the data line terminals 306of the liquid-crystal panel display 100 when brought into contact.

Second Embodiment

Next, the second embodiment will be described. In the following, thesame reference numbers are given to the same or similar compositionelements as those in the first embodiment, and the descriptions forthose elements are simplified or omitted.

In the first embodiment, the bear chip 10 is provided on the siliconsubstrate 2. However, in the second embodiment, the bear chip 10 isprovided on a second substrate 20, which defers from the siliconsubstrate 2.

As shown in FIG. 4, the bear chip 10 is not provided on the siliconsubstrate 2, and the second insulating layer 8 covers the secondconductive part 5 almost entirely excluding the connection terminals 5T.Further, on a lower surface 20B of the second substrate 20, third wiringpatterns are formed corresponding to the connection terminals 5Tcomposed of the −X-side end portion of the second wiring patterns 5L ofthe second conductive part 5. The bear chip 10 is mounted on the thirdwiring patterns provided on the lower surface 20B of the secondsubstrate 20. Then, by electrically connecting the third wiring patternsof the second substrate 20 with the connection terminals 5T of thesilicon substrate 2, the electric signals are supplied from the bearchip 10 to the scanning line terminals 206 of the liquid-crystal paneldisplay 100 through the third wiring patterns, the connection terminals5T, the second wiring patterns 5L, and the first wiring patterns 4L.

The second substrate 20 is composed of a glass substrate. Consequently,when connecting the third wiring patterns on the lower surface 20B ofthe second substrate 20 with the connection terminals 5T of the secondconductive part 5 on the silicon substrate 2 while positioning themvisually (or by use of the optical position-detection device), forexample, it is possible to check the connection condition of the thirdwiring patterns on the second substrate 20 connected to the connectionterminals 5T on the silicon substrate 2 through the second substrate 20made of glass (seeing through the second substrate 20). Hence, thepositioning at the time of connection can be smoothly carried out.

Alternatively, the second substrate 20 can be composed of silicon. Bycomposing the second substrate 20 with silicon, the third wiringpatterns corresponding to the connection terminals 5T (the second wiringpatterns 5L) of the minutely-made test probe 1 can be formed on thesecond substrate 20.

(Method for Manufacturing the Test Probe)

Next, the method for manufacturing the test probe 1 will be describedwith reference to FIGS. 5-7. It is to be noted here that a plurality of(in the drawings, two) test probes 1 are formed simultaneously.

First, as shown in FIG. 5(A), the first insulating layer 6 is formed onthe upper surface 2A of the silicon substrate 2. Then, as shown in FIG.5(B), the resin for forming the protrusion 3 is disposed on thepredetermined region on the first insulating layer 6. The protrusion 3is formed into the half-cylindrical shape, extending in thepredetermined direction (the Y-axis direction) on the silicon substrate2. In this embodiment, the protrusion 3 is formed based on a liquiddispensing method (an ink-jet method). According to the liquiddispensing method, as shown in FIG. 5(B), a liquid dispensing head (anink-jet head) 50 dispenses a liquid drop D that is a functional liquidcontaining the resin for forming the protrusion 3 onto the siliconsubstrate 2 (the first insulating layer 6). As a consequence, theprotrusion 3 having the shape of an arch in a cross-sectional view whosesurface bulges in the direction opposite (that is, in the upperdirection) from the silicon substrate 2 is formed. By forming theprotrusion 3 by the liquid dispensing method, the material can be usedeconomically, and the protrusion 3 can be formed smoothly.Alternatively, the protrusion 3 may be formed by a photolithographymethod. In this case, the protrusion 3 contains a photosensitive resin.Depending on conditions of exposure, development, curing, and the like,the protrusion 3 having the shape of an arch in a cross-sectional viewcan be formed easily and with high precision. Next, as shown in FIG.5(C), the conductive part 9 including the first and second conductiveparts 4 and 5 is formed on each of the protrusion 3 and the firstinsulating layer 6. The conductive part (wiring pattern) 9 can be formedby sputtering, plating, and liquid dispensing (ink-jet) methods. On theprotrusion 3, the plurality of first wiring patterns 4L arranged in alongitudinal direction of the protrusion 3 are formed as the firstconductive part 4 that come in contact with the scanning line terminals206. In the region other than the region where the protrusion 3 isprovided, the second wiring patterns 5L electrically connected to thefirst wiring patterns 4L are formed.

Next, as shown in FIG. 6(A), an O₂ plasma treatment is conducted. By theO₂ plasma treatment, the region on the surface of the protrusion 3 otherthan the region having the first wiring patterns 4L is selectivelyhalf-etched, while the first wiring patterns 4L are a mask. As aconsequence, as shown in FIG. 3, the dented parts 3Ds are formed betweenthe first wiring patterns 4L. Then, as shown in FIG. 6(B), the secondinsulating layer 8 that covers the second conductive part 5 is provided.Thereafter, a given process such as a polishing process is carried outto the lower surface 2B of the silicon substrate 2, and, because of thistreatment, the silicon substrate 2 is thinned to have the desiredthickness (of 200 μm or less).

Next, as shown in FIG. 7(A), the sheet form that acts as the thirdinsulating layer 7 is applied to the lower surface 2B of the siliconsubstrate 2 opposite from the upper surface 2A on which the protrusion 3and the conductive part 9 are provided. As described, in the embodiment,the plurality of test probes 1 are formed on the same silicon substrate2. Then, by using the applied sheet form as a sheet for dicing, thesilicon substrate 2 is diced (cut) per every test probe 1 together withthe sheet form as shown in FIG. 7(B). By thus forming the plurality oftest probes 1 almost simultaneously on the silicon substrate 2, and thenby dicing the silicon substrate 2 per every test probe 1, the testprobes 1 can be efficiently produced while enabling reduction of thecost of the test probes 1. Then, by simply using the sheet form used forthe dicing as the third resin layer 7, the number of steps required forthe manufacture can be reduced, and the manufacture of the test probes 1can be realized at low cost. After the dicing, the bear chips 10 aremounted as shown in FIG. 7(C), and the test probes 1 can be obtained.

<Tester>

FIG. 8 is a diagram outlining an example of a tester 70 having the testprobe 1. In FIG. 8, the tester 70 includes a holder 72 for holding thesubstrate 200, which is the device to be tested, and an adjustment unit71 that can adjust the positions and postures of the holder 72 holdingthe substrate 200. The holder 72 holds the region other than thepredetermined region 204 on the substrate 200. At a position oppositethe predetermined region 204 on the substrate 200 held by the holder 72,the first conductive part 4 provided on the protrusion 3 of the testprobe 1 is arranged. Also, there is a presser 73 made of elastic matterabove the first conductive part 4 interposing the substrate 200. Withthe tester 70, while keeping the scanning line terminals 206 of thesubstrate 200 and the first conductive part 4 of the test probe 1 inposition, the substrate 200 is pressed against the test probe 1 by thepresser 73 made of elastic matter. As a consequence, the scanning lineterminals 206 are adhered and electrically connected to the first wiringpatterns 4L. A condition is thereby set for the plurality of scanninglines 202 on the substrate 200 to receive from the bear chip 10 the samedriving signals as those when the bear chip 10 is mounted on the portionof the scanning line terminals 206 of the substrate 200 by the COGtechnique. Therefore, by examining the liquid display in this conditionby use of the image analysis such as the CCD or visually, the displaytest such as the pixel defect test can be conducted. Additionally, thecomposition of the tester 70 may include the second substrate 20 asdescribed with reference to FIG. 4.

It is to be noted that the device to be tested by the test probe and thetester of the invention is not limited to the liquid-crystal paneldisplay. Any device having terminals can be tested by the test probe andthe tester of the invention.

1. A method for manufacturing a test probe, comprising: having aconductive part electrically connected to terminals of a test-objectdevice; providing a protrusion made of resin on a silicon substrate;providing a first conductive part that comes in contact with theterminals on the protrusion; and providing a second conductive part thatis electrically connected to the first conductive part in a region otherthan a region having the protrusion on the silicon substrate.
 2. Themethod according claim 1, further comprising: forming the protrusion soas to extend in a first direction; and providing a plurality of firstwiring patterns in the first direction on the protrusion as the firstconductive part.
 3. The method according claim 2, further comprisingdenting a region on the protrusion surface other than a region havingthe first wiring patterns by half-etching.
 4. The method according claim1, further comprising forming the protrusion in a shape of an arch whenseen cross-sectionally, the surface thereof bulging in a directionopposite from the silicon substrate.
 5. The method according claim 1,further comprising forming the protrusion by dispensing a functionliquid containing the protrusion-forming resin from a liquid dispensinghead onto the silicon substrate.
 6. The method according claim 1,further comprising forming a second insulating layer so as to cover thesecond conductive part.
 7. The method according claim 1, furthercomprising thinning the silicon substrate.
 8. The method according claim1, further comprising providing a third insulating layer made of resinon a second surface of the silicon substrate opposite from a firstsurface having the protrusion and the conductive part.
 9. The methodaccording claim 8, further comprising adhering a sheet form to thesecond surface of the silicon substrate as the third insulating layer.10. The method according claim 8, further comprising thinning thesilicon substrate by treating the second surface before providing thethird insulating layer.
 11. The method according claim 1, furthercomprising dicing the silicon substrate per every test probe afterforming the plurality of test probes on the same silicon substratealmost simultaneously.
 12. The method according claim 11, furthercomprising: adhering a sheet form to the second surface of the siliconsubstrate opposite from the first surface having the protrusion and theconductive part; and dicing the silicon substrate together with thesheet form.